The Z68 is a flip-chip BGA (FCBGA). The die is mounted "upside down" on the package substrate, and an epoxy filler is used between the chip and the package substrate. You can refer to the drawing in the datasheet (doc # 324645-006) or in the thermal-mechanical specifications (doc # 324647-004), both of which can be downloaded from http://developer.intel.com.
Many thanks for the reply.
Would there be bond wires inside the polished part of this chipset ? If the die is the basically the chip itself then what does the rest of the packaging (polished green area) contain ? Would Intel have any snapshots of what this chip looks like without its packaging ? One last think the two documents that you quoted above I am unable to download them. If you could provide the exact download link for both of these documents it would be appreciated. I tried going to http://developer.intel.com but it redirects to the home page (Ultrabook, SmartPhone, Laptop, Desktop, Server & Embedded– Intel) for Intel.
Really appreciate the reply.
I can get frustrated looking for Intel docs also.
Datasheet is here:
Specification update is here:
Thermal mechanical guide is here:
The package substrate (green) is a multi-layer circuit board that connects the package balls to the bumps on the die. There are no wire bonds. There may also be some passive components mounted on the package substrate.