I wonder How to test my thermal solution can meet cpu TDP requirement?
I am now using TAT to test CPU Thermal condition.(mobile CPU skylake U type)
To let CPU power consumption meet TDP I choose TDP workload for my test loading.
But the "package power" is lower than SKU's TDP.
I find that Graphic frequency is about 350MHZ.
When I change the graphic frequency setting to "No Limit".
The graphic frequency will up to 950MHZ and package power is near TDP level.
So below are my questions:
1.What is the standard to test CPU thermal condition?
2.If question 1 answer is choosing TDP workload for loading.Do I need to change graphic frequency to let package power approach TDP?