Are you talking about a NUC product? The heights of the SOC and other components that also need to be cooled by the heatsink-blower unit are not the same and, while the SOC (being the highest) can use TIM, thermal conducting foam is needed to handle the height differences of the other components.
This foam is a standard product and available from many sources in varying sizes, thicknesses and efficiencies. While this isn't the most technical of descriptions (hey, software guy talking), it is one that will work in internet searches...
Hope this helps,
No NUC, this is for another DH67 (they're everywhere, they're everywhere). The actual chipset is small, maybe 3/8" squared, but the heat sink over it is much larger, maybe 1.25" squared. I guess I'll buy some Arctic or StarTech heat sink thermal pads. If I cut a piece as large as the underside of the heat sink, it'll make installation easy.
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This is what I just found on ebay.com about CPU thermal adhesive:
NOTE: This link is being offered for your convenience and should not be viewed as an endorsement by Intel of the content, products, or services offered there.
Those products are not tested or recommended by Intel since this clearly voids the Intel product warranty.