"Strain Measurement Methodology for Circuit Board Assembly: Guide"

[JPfei3]

I have a document from intel named "Strain Measurement Methodology for Circuit Board Assembly: Guide." In it there is an image referencing three strain gage locations also discussed in this document. There is the POR location, ALT1 location, and ALT2 location. I would like to know what is the difference between these strain gage placement locations in the amount of strain they measure. Do they measure the same amount of strain occuring at the corner of the BGA component? Or, do they measure some slight difference in the amount of strain on the corner of the BGA component?

[Allan_J_Intel1]

Are you developing any type of hardware with Intel components?

Are you a hardware designer?

Allan.

[JPfei3]

I am testing a PCB with the Intel Atom E3815 processor on it to quantify the strain in the corners of this component when we apply a load to the board (heatsink clip applying 3 lbs. of force). I am a mechanical engineer.

[JPfei3]

Did you find the document I am referring to from the intel website?

[JPfei3]

If it helps, more simply, yes I am developing hardware with intel components. Thanks!

-Jake

[Allan_J_Intel1]

Yes, I found the document on the Intel web site. For this type of issues you need to contact our developer department at: http://www.intel.com/content/www/us/en/embedded/embedded-design-center.html Resources for Embedded and IoT Designers

https://software.intel.com/en-us/forum https://software.intel.com/en-us/forum

Allan.