This is designed to be a quick overview of the most common 82574 questions we get.  This is not designed to replace a reading of the datasheet and spec update.  In fact, the datasheet and spec update are required reading, and, if they conflict, the datasheet and spec update are right and this page is wrong.  If you like this type of FAQ, leave us a comment and maybe we will do more of them.  Also, we may not update this page in the future so I can’t say this enough; check the datasheet and spec update!


Q: Does the 82574 support EEPROM-less designs?

A:  No. The 82574 requires an EEPROM or a Flash for proper operation.


Q. What power supplies does the 82574 require?

A:  3.3V, 1.9V and 1.0V.


Q. Which power rails are sourced from main power?

A:  In order to support manageability and Wake on LAN features, all 82574 power supplies should be derived from AUX power.


Q:  I’m working on an 82574L design and it is going into an ARM* platform that does not offer a PERST# signal.   I had them pull it high and then de-assert it before the PCIe* setup sequence started and it’s working but I want to know of any specific timing requirements for this situation:

A:  PCI Express CEM r2.0.pdf section 2.2 PERST# Signal defines very specifically what the expectations are for this signal (Tperst is the variable I believe you were asking about). The Tperst min is stated as 100µs (applies to S0->S3->S0). However, if this is the G3->S0 transition PERST should be kept low from the power on to 100ms after power is known to be stable.


Q: What is the purpose of ATEST_P and ATEST_N?  Is there a way to measure the GTX clock (125MHz)?

A: Don't use the ATEST pins.  There are a few IEEE tests that require a different methodology of determining the clock. The tests can still be done and we document how to do the standard tests without a clock.  The best way to measure the crystal frequency is using a high impedance probe, a probe amp, and a counter.


Q: Are any LAN Voltage Regulator options problematic?

A:  In early 82574 designs we advised allowing multiple options to reduce risk.  Since then we have tested all the options well and have had customers successfully using all the options.  Therefore we can now state that there is no additional risk at this point to using any of our recommended power options detailed in the 82574L datasheet.


Q:  I want to change the MDI to MDI-X on my board (crossover).  Is there anything else they need to do to support this in the EEPROM or SW?

A:  No, the 82574L's Auto MDI-X auto detects when MDI-X is needed.  As long as you have the pins connected correctly you don't need to do anything else.


Q:  There is a different recommendation in the datasheet or checklist compared with the reference schematic (Resistor Value, Capicitor Value, etc).  Which document do I go by?

A:  When there is a conflict, please follow the reference schematic's recommendation since this was validated with a real board design. Also, let us know so that we can update the documentation.


Q: What if I want to use a 10/100 magnetic for my design?

A: You could, but you should consider the following points:

1.)    Intel chose not to validate 10/100 magnetics because the cost of a gigabit magnetic is often equivalent or CHEAPER in a few cases compared to 10/100 magnetics.

2.)    If you want to use only 10/100 but use gigabit magnetics, you can disable and enable gigabit mode with an EEPROM bit.  This allows for flexibility and upgrades by changing a single bit.


Q:  Where can I find the schematic and layout symbols for 82574L?

A:  OrCAD and Cadence symbols for 82574L can be found on CDI (Intel’s Classified Design Information documentation available to customers with NDAs). We don’t supply layout symbols for our parts since the footprint can be very board process-specific. Since 82574L is a 64 pin QFN the designer probably already has an appropriate symbol in his library. If not, the mechanical specs, etc, in the datasheet can be used to create one.


Q:  Why is Intel using different crystal loading capacitance values (33pF vs 27pF) between the Intel® 82578 GbE Network Connection and 82574L LAN chips?

A:  82578 uses 33pF capacitors to achieve a Cload = 18pF to ensure that the pullability (ppm) of the crystal is small.  This loading capacitor value was found during the crystal validation to be optimal for meeting the 30ppm specification for the crystal.  82574L's validation resulted in the value of 27pF.  The specific board capacitance on a particular design can impact the results customers should test their crystal circuit to verify that the ppm requirements are met with the recommended capacitance values.


Q:  The LAN connector on 82574L has a 1.9V bias being applied to the magnetics, but this is not the case for 82578.  Shouldn't we be applying a voltage to the 82578 connector as well?

A:  The 1000BASE interface on the 82578 and the 82574L have different architectures for the PHY drivers.  The 82578 has a voltage mode driver while the 82574L has a current mode driver.  A current mode driver requires a voltage source at the Center tap of the magnetics but a voltage mode driver requires that the center tap be connected to Ground.  Here is an article on the difference for your reference.


Q:  How long can NC-SI traces be for 82574L?

A:  Our simulations show that a two drop NC-SI interface is functional but not spec compliant up-to 19-20 inches depending on the number of vias.    The interface is spec complaint up to about 7.5 or 8 inches.


Q:  How do I know if I designed in my 82574L correctly?

A:  We can check your homework!  Just submit your design to Intel via premier.intel.com or via your parts source for a one time schematic review and we’ll (for FREE) review the design and let you know what we think.  We also do layout reviews.  Did I mention it’s free?