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September 18, 2009 Previous day Next day

Meet the Rock Stars of PCI, PCI Express and USB Initiatives at IDF.

 

The real Ajay Bhatt and other Intel Rock Stars will be on hand to take your questions about PCIe and USB.  You might even get him to sign an Ajay Bhatt t-shirt if you ask a question that’s not too hard for him to answer!

 

  • This event is on Tuesday Sept 22nd at 6pm in room 2004, level 2.

  • For the real scoop on what’s going on in PCIe today

    • consider attending the following sessions on Thursday, Sept 24th in room 2003 starting at 11.10am.

 

 

 

11.10-Noon: TCIS006: PCI Express* 3.0 Technology: Device Architecture optimizations on Intel Platforms

 

This session is for developers with advanced knowledge of PCI Express* Technology and related usage models. This session will help developers comprehend platform implementation challenges and what is needed to build the ecosystem for successful product deployment.

Topics include:

 

  • Overview of PCI Express* (PCIe*) 2.1 and 3.0 technology protocol extensions as well as the power/performance benefits and applicability across various market segments
  • Implementation considerations for a selected set of PCIe Technology protocol extensions aimed at Intel based platforms
  • Software development required for these features.

 

 

1.40-2.30pm: TCIS007: PCI Express* 3.0 Technology: PHY Implementation Considerations on Intel Platforms

 

This session is intended for developers with advanced knowledge of PCI Express* Technology.

This session will help developers appreciate, understand, and address implementation challenges related to the encoding scheme.

Topics include:

 

  • An overview of Intel’s analysis of the logical layer enhancements required for the PCI Express* 3.0 technology operating at 8.0 GT/s
  • Implementation challenges and considerations for Intel based platforms.

 

 

2.40-3.30pm: TCIS008: PCI Express* 3.0 Technology: Electrical Requirements for Designing ASICs on Intel Platforms

 

This session will focus on the electrical and mechanical elements of designing PCIe with topics to include:

 

  • Overview of silicon and motherboard/add-in card design features required to support typical PCI Express* Technology one connector and two connector topologies at 8.0 GT/s
  • Analysis of studies for deeper understanding of transmit and receive equalization schemes, measurement, and testing
  • Process for determining form factor specific electrical requirements, PCB design guidelines, and add-in card and motherboard test methodologies.

 

 

3.40-4.10pm: TCIQ002: Q&A and panel on PCI Express

 

Get any lingering questions you have on PCIe at this open session where no PCIe question will go un-answered!

We seem to have an insatiable appetite for all kinds of computing equipment.  I remember my parents carrying a cell phone the size a football.  I thought they were way cool. Today, my 7 year old cousin has a blackberry, not sure how I feel about that.  I suspect that she is more tech savvy than I am.

 

Needless to say, the use and proliferation of electronic products has grown substantially over the past two decades, changing the way and the speed in which we communicate and how we get information and entertainment.  According to the Consumer Electronics Association (CEA), Americans own approximately 24 electronic products per household. So I did a quick inventory at my own place and came up with 12. True, I fell short, but I am a household of one and not a techie.  With all this electronic stuff out there, ever wonder what happens to it? Does it end-up in a landfill?   Can you donate or recycle? The answer is not as straight forward as my might think.

 

Relative to a few years ago, it is easier to recycle.  Some OEMs offer free recycling.  In the EU the Waste Electrical and Electronic Equipment (WEEE) Directive provides direction regarding recycling options.  19 US states have also passed laws that mandate recycling.  But we have a long way to go, as only 15-17% of the equipment that we do not want is recycled.  So I pose the question, how do we work as an industry to increase recycling? Can we design compute equipment to help with recycling? What are HP and DELL doing?  What can we learn from them?  If you are curious, come to the LCA panel discussion at IDF and hear first hand from the experts and no, my 7 year old cousin will not be there.

Last month, Intel added another high-performing, low power to the Xeon 5500 SKU lineup with the Intel Xeon L5530 processor (2.40 GHz, 60W TDP).  As with the L5506 (2.13 GHz) and L5520 (2.26 GHz) SKUs that were launched in March, the L5530 deliver the same performance as its 80W counterpart (E5530), but at 25% lower CPU power.

With space being a valuable asset in power-constrained data centers (IDC estimates datacenter construction costs at an average of $1,000/sq ft and $40,000/rack), the Xeon L5530 delivers even more performance in the same 60W CPU power envelope to help get the most out of each rack. Here’s the tale of the tape:

  • 66% more performance than previous generation Xeon L5420 SKU
  • 45% more performance than the Xeon L5506 SKU

(performance numbers based on SPEC_int_rate2006*, see http://www.spec.org/cpu2006/results/ for more details)

Want to find out more about the Xeon L5530 and the rest of the 5500 lineup, check out:  http://www.intel.com/p/en_US/products/server/processor/xeon5000

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